In order to have a comprehensive overview about contents, objectives and partners of the SUPERSMART project, there is a new flyer for download available: Download: Supersmart_Projektflyer
Michel Glotin from Supersmart Coordinator Arkema will present first results of the Supersmart project at EIT Raw Materials Summit 2019. This summit takes place between May, 20 and May, 22 in Berlin, Germany.
Supersmart partner VTT will participate at AIPIA USA Summit on July, 3-4, 2019 in New Jersey. VTT will exhibit amongst other technical samples from Supersmart project in order to demonstrate technical solutions for smart paper and packaging.