Supersmart Project
  • MOTIVATION & IMPACT
  • TECHNOLOGIES
  • PARTNERS
  • NEWS & EVENTS
  • PUBLICATIONS
Seite wählen

Presentation of SUPERSMART project at EIT Raw Materials Summit 2019

von madeleine.geiling@isc.fraunhofer.de | Mai 15, 2019 | General, Messe

Michel Glotin from Supersmart Coordinator Arkema will present first results of the Supersmart project at EIT Raw Materials Summit 2019. This summit takes place between May, 20 and May, 22 in Berlin, Germany.

Participation from VTT at AIPIA USA Summit

von madeleine.geiling@isc.fraunhofer.de | Mai 15, 2019 | General, Messe

Supersmart partner VTT will participate at AIPIA USA Summit on July, 3-4, 2019 in New Jersey. VTT will exhibit amongst other technical samples from Supersmart project in order to demonstrate technical solutions for smart paper and packaging.

New posts

  • SUPERSMART – paper-based printed electronics as environmentally friendly and cost-efficient alternative
  • Winner OE-A Competition 2021
  • Press Release published adressing ECOtronics project
  • Supersmart Flyer available
  • Presentation of SUPERSMART project at EIT Raw Materials Summit 2019

New comments

    Archive

    • April 2021
    • März 2021
    • Dezember 2019
    • Juli 2019
    • Mai 2019
    • April 2019

    Categories

    • General
    • Messe
    • News

    About the project

    This activity has received funding from the European Institute of Innovation and Technology (EIT). This body of the European Union receives support from the European Union's Horizon 2020 research and innovation programme.

    Service

    • CONTACT
    • PUBLISHING NOTES
    • EDITORIAL NOTES
    • DATA PROTECTION

    Partner Links

    • arjowiggins
    • Coatema
    • CEA
    • Fraunhofer ISC
    • FCT Uninova
    • Joanneum Research
    • Luquet-Duranton
    • Piezotech Arkema Group
    • Université de Bordeaux
    • VTT

    SUPERSMART PROJECT ©2018